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UPD70F3557AM1GMA1-GBK-AX Images
- Manufacturer: Renesas Electronics
- Category: Integrated Circuits (ICs)~Embedded - Microcontrollers Package/Case: 176-LQFP Exposed Pad
- Description: IC MCU 32BIT 1.5MB FLSH 176HLQFP
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UPD70F3557AM1GMA1-GBK-AX Specifications:
- MfrPart.: UPD70F3557AM1GMA1-GBK-AX
- Mfr: Renesas Electronics America Inc
- Description: IC MCU 32BIT 1.5MB FLSH 176HLQFP
- Product Category: Integrated Circuits (ICs)~Embedded - Microcontrollers
- Package: Tray
- Series: V850E2/Fx4
- PartStatus: Obsolete
- CoreProcessor: V850E2
- CoreSize: 32-Bit
- Speed: 80MHz
- Connectivity: CANbus, CSI, I²C, LINbus, UART/USART
- Peripherals: DMA, PWM, WDT
- NumberofI/O: 136
- ProgramMemorySize: 1.5MB (1.5M x 8)
- ProgramMemoryType: FLASH
- EEPROMSize: 64K x 8
- RAMSize: 112K x 8
- Voltage-Supply(Vcc/Vdd): 3V ~ 5.5V
- DataConverters: A/D 40x12b
- OscillatorType: Internal
- OperatingTemperature: -40°C ~ 110°C (TA)
- MountingType: Surface Mount
- Package/Case: 176-LQFP Exposed Pad
- UPD70F3557AM1GMA1-GBK-AX Renesas, IC MCU 32BIT 1.5MB FLSH 176HLQFP, Integrated Circuits (ICs)~Embedded - Microcontrollers
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